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SEMI 3D16 : 2016

SEMI 3D16 : 2016

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING

Superseded date

05-09-2022

Published date

01-01-2016

Publisher

Semiconductor Equipment & Materials Institute

Pertains to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure glass as base material to be used in a 3DS-IC process or in similar applications.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (11/2016)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Superseded
SupersededBy

SEMI M35 : 2014 GUIDE FOR DEVELOPING SPECIFICATIONS FOR SILICON WAFER SURFACE FEATURES DETECTED BY AUTOMATED INSPECTION
SEMI MF533 : 2010(R2016) TEST METHODS FOR THICKNESS AND THICKNESS VARIATION OF SILICON WAFERS
SEMI M59 : 2014 TERMINOLOGY FOR SILICON TECHNOLOGY
SEMI E119 : JUL 2006(R2012) MECHANICAL SPECIFICATION FOR REDUCED-PITCH FRONT-OPENING BOX FOR INTERFACTORY TRANSPORT OF 300 MM WAFERS
SEMI M45 : 2010(R2017) SPECIFICATION FOR 300 MM WAFER SHIPPING SYSTEM
SEMI MF928 : 2017 TEST METHOD FOR EDGE CONTOUR OF CIRCULAR SEMICONDUCTOR WAFERS AND RIGID DISK SUBSTRATES
SEMI MF1530 : 2007(R2018) TEST METHOD FOR MEASURING FLATNESS, THICKNESS, AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING
SEMI MF1451:2007(R2019) TEST METHOD FOR MEASURING SORI ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING
SEMI 3D7 : 2013(R2019) GUIDE FOR ALIGNMENT MARK FOR 3DS-IC PROCESS
SEMI MF2074 : 2012 (R2018) GUIDE FOR MEASURING DIAMETER OF SILICON AND OTHER SEMICONDUCTOR WAFERS
SEMI M31 : 2008 MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS
SEMI 3D12 : 2015 GUIDE FOR MEASURING FLATNESS AND SHAPE OF LOW STIFFNESS WAFERS
SEMI MF1152 : 2016 TEST METHOD FOR DIMENSIONS OF NOTCHES ON SILICON WAFERS
SEMI M40 : 2014 GUIDE FOR MEASUREMENT OF ROUGHNESS OF PLANAR SURFACES ON POLISHED WAFERS
SEMI MF657 : 2007E TEST METHOD FOR MEASURING WARP AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY NONCONTRAST SCANNING
SEMI 3D11 : 2014 TERMINOLOGY FOR THROUGH GLASS VIA AND BLIND VIA IN GLASS GEOMETRICAL METROLOGY
SEMI T7 : 2016 SPECIFICATION FOR BACK SURFACE MARKING OF DOUBLE-SIDE POLISHED WAFERS WITH A TWO-DIMENSIONAL MATRIX CODE SYMBOL
SEMI MF671:2012 TEST METHOD FOR MEASURING FLAT LENGTH ON WAFERS OF SILICON AND OTHER ELECTRONIC MATERIALS

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