SEMI 3D16:2022
Current
Current
The latest, up-to-date edition.
Specification for Glass Base Material for Semiconductor Packaging
Available format(s)
Hardcopy
Language(s)
English
Published date
01-08-2022
Important note : Users cannot be edited or removed once added to your Multi user PDF.This Specification is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure glass as base material to be used in a 3DS-IC process or in similar applications.
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
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