SEMI 3D16:2022
Current
Current
The latest, up-to-date edition.
Specification for Glass Base Material for Semiconductor Packaging
Available format(s)
Hardcopy
Language(s)
English
Published date
01-08-2022
This Specification is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure glass as base material to be used in a 3DS-IC process or in similar applications.
Important note : Users cannot be edited or removed once added to your Multi user PDF.Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.