• Shopping Cart
    There are no items in your cart

SEMI 3D3:2013(R2018)

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames

Available format(s)

Hardcopy

Superseded date

16-11-2023

Superseded by

SEMI 3D3:2023

Language(s)

English

Published date

01-12-2018

€152.54
Excluding VAT

This Guide provides the user with information about containers needed to ship thin wafers that are mounted on dicing tape to tape frames conforming to either SEMI G74 or SEMI G87.

DocumentType
Guide
Pages
0
PublisherName
Semiconductor Equipment & Materials Institute
Status
Superseded
SupersededBy
Supersedes

SEMI G94:2013 SPECIFICATION FOR COIN-STACK TYPE TAPE FRAME SHIPPING CONTAINER FOR 300 MM WAFER

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.