SEMI E51 : 2000
Current
The latest, up-to-date edition.
GUIDE FOR TYPICAL FACILITIES SERVICES AND TERMINATION MATRIX
12-01-2013
The aim is to give a cost-effective and timely tool installation with minimum impact on the existing customer services, systems or facilities to insure that the quality of facilities supplied (eg chemical, gases, water) is not compromised once internal to the tool. It provides the equipment supplier with an understanding of the facilities available at the POC point of connection at the "typical" customer site. This document does not include site-specific conditions. When site specifications differ the user should create a site-specific matrix that is submitted with the request for a quote. Each tool should be supplied in a "facility ready" state. This document gives the range of conditions in which equipment should be capable of operating.
DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
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DocumentType |
Standard
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PublisherName |
Semiconductor Equipment & Materials Institute
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Status |
Current
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SEMI E70 : 2013 | GUIDE FOR TOOL ACCOMMODATION PROCESS |
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SEMI F47 : 2006(R2012) | SPECIFICATION FOR SEMICONDUCTOR PROCESSING EQUIPMENT VOLTAGE SAG IMMUNITY |
SEMI E7 : 1991(R2004) | SPECIFICATION FOR ELECTRICAL INTERFACES FOR THE U.S. ONLY |
SEMI F47 : 2006(R2012) | SPECIFICATION FOR SEMICONDUCTOR PROCESSING EQUIPMENT VOLTAGE SAG IMMUNITY |
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SEMI E6 : 2014 | GUIDE FOR SEMICONDUCTOR EQUIPMENT INSTALLATION DOCUMENTATION |
SEMI E33 : 2017 | GUIDE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT ELECTROMAGNETIC COMPATIBILITY (EMC) |
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