SEMI E76 : 1999(R2013)
Current
Current
The latest, up-to-date edition.
GUIDE FOR 300 MM PROCESS EQUIPMENT POINTS OF CONNECTION TO FACILITY SERVICES
Published date
12-01-2013
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Specifies strategies to support the device manufacturer's ability to pre-facilitate the utility point of connection (UPOC).
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001) Supersedes SEMI PR2. (09/2005)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
| SEMI E149 : 2014 | GUIDE FOR EQUIPMENT SUPPLIER-PROVIDED DOCUMENTATION FOR THE ACQUISITION AND USE OF MANUFACTURING EQUIPMENT |
| SEMI F107 : 2009 | GUIDE FOR PROCESS EQUIPMENT ADAPTER PLATES |
| SEMI E6 : 2014 | GUIDE FOR SEMICONDUCTOR EQUIPMENT INSTALLATION DOCUMENTATION |
| SEMI S2 : 2016B | ENVIRONMENTAL, HEALTH, AND SAFETY GUIDELINE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT |
| SEMI E6 : 2014 | GUIDE FOR SEMICONDUCTOR EQUIPMENT INSTALLATION DOCUMENTATION |
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