SEMI G32 : 1994(R2011)
Current
The latest, up-to-date edition.
GUIDELINE FOR UNENCAPSULATED THERMAL TEST CHIP
12-01-2013
Details recommendations for a standardized thermal test chip design for referee test purposes. Sample data format for the test chip can be found in Appendix A. The following recommendations are made for the design of thermal test chips for VLSI package characterization based on the results of computer simulations of various chip-substrate configurations.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
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| SEMI G42 : 1996(R2018) | SPECIFICATION FOR THERMAL TEST BOARD STANDARDIZATION FOR MEASURING JUNCTION-TO-AMBIENT THERMAL RESISTANCE OF SEMICONDUCTOR PACKAGES |
| SEMI G43 : 1987(R2011) | TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS OF MOLDED PLASTIC PACKAGES |
| SEMI G38 : 2018 | TEST METHOD FOR STILL- AND FORCED-AIR JUNCTION-TO-AMBIENT THERMAL RESISTANCE MEASUREMENTS OF INTEGRATED CIRCUIT PACKAGES |
| SEMI G68 : 1996(R2018) | TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS IN AIR ENVIRONMENT FOR SEMICONDUCTOR PACKAGES |
| BS PD ES 59008-4.3 : 2000 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-3: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - THERMAL |
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