Customer Support: +353 (0)1 857 6730

Corporate Website About Us
  • There are no items in your cart
Please enter a keyword to search
Advanced search
Home
SEMI
SEMI G32 : 1994(R2011)

SEMI G32 : 1994(R2011)

Current

Current

The latest, up-to-date edition.

GUIDELINE FOR UNENCAPSULATED THERMAL TEST CHIP

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Details recommendations for a standardized thermal test chip design for referee test purposes. Sample data format for the test chip can be found in Appendix A. The following recommendations are made for the design of thermal test chips for VLSI package characterization based on the results of computer simulations of various chip-substrate configurations.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G42 : 1996(R2018) SPECIFICATION FOR THERMAL TEST BOARD STANDARDIZATION FOR MEASURING JUNCTION-TO-AMBIENT THERMAL RESISTANCE OF SEMICONDUCTOR PACKAGES
SEMI G43 : 1987(R2011) TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS OF MOLDED PLASTIC PACKAGES
SEMI G38 : 2018 TEST METHOD FOR STILL- AND FORCED-AIR JUNCTION-TO-AMBIENT THERMAL RESISTANCE MEASUREMENTS OF INTEGRATED CIRCUIT PACKAGES
SEMI G68 : 1996(R2018) TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS IN AIR ENVIRONMENT FOR SEMICONDUCTOR PACKAGES
BS PD ES 59008-4.3 : 2000 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-3: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - THERMAL

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Get in touch with us