SEMI G38 : 2018
Current
Current
The latest, up-to-date edition.
TEST METHOD FOR STILL- AND FORCED-AIR JUNCTION-TO-AMBIENT THERMAL RESISTANCE MEASUREMENTS OF INTEGRATED CIRCUIT PACKAGES
Published date
12-01-2013
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Describes junction-to-ambient measurements of thermal resistance and limits itself to still- and forced-air convection testing environments.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G32 : 1994(R2011) | GUIDELINE FOR UNENCAPSULATED THERMAL TEST CHIP |
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