SEMI G42 : 1996(R2018)
Current
The latest, up-to-date edition.
SPECIFICATION FOR THERMAL TEST BOARD STANDARDIZATION FOR MEASURING JUNCTION-TO-AMBIENT THERMAL RESISTANCE OF SEMICONDUCTOR PACKAGES
12-01-2013
Provides requirements for a standard thermal resistance test board to be used in junction-to-ambient thermal resistance measurement of a semiconductor package under still- and forced-air condition as a referee method. Also describes the thermal resistance test board for measurement of the following packages: - plastic chip carrier package (PCC); - dual-in-line packages (DIP); - pin grid array package (PGA); - quad flat package (QFP); - and ball grid array package (BGA).
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
|
| SEMI G32 : 1994(R2011) | GUIDELINE FOR UNENCAPSULATED THERMAL TEST CHIP |
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