SEMI G43 : 1987(R2011)
Current
The latest, up-to-date edition.
TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS OF MOLDED PLASTIC PACKAGES
12-01-2013
Test purpose is to determine the thermal resistance of molded- plastic packages using thermal test chips. Test method only deals with junction-to-case measurements of thermal resistance and limits itself to fluid bath testing environments. For this test, conduction through the leads is minimized, thus providing information on the ability of the plastic package material to dissipate heat. Due to the effects of the variable nature of the fluid-stirring and package-mounting procedures and the thermophysical properties of the heat transfer fluids used, this test method should only be used for comparing the thermal characteristics of plastic packages in the same fluid bath system.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
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| SEMI G68 : 1996(R2018) | TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS IN AIR ENVIRONMENT FOR SEMICONDUCTOR PACKAGES |
| BS PD ES 59008-4.3 : 2000 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-3: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - THERMAL |
| SEMI G32 : 1994(R2011) | GUIDELINE FOR UNENCAPSULATED THERMAL TEST CHIP |
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