SEMI G74:1999(R2020)
Current
Current
The latest, up-to-date edition.
Specification for Tape Frame for 300 mm Wafers
Available format(s)
Hardcopy
Language(s)
English
Published date
01-10-2020
Important note : Users cannot be edited or removed once added to your Multi user PDF.
The purpose of this Document is to standardize the specifications for 300 mm wafer tape frames used between the dicing process and the die-bonding process.
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
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