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SEMI G74 : 1999(R2015)

SEMI G74 : 1999(R2015)

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SPECIFICATION FOR TAPE FRAME FOR 300 MM WAFERS

Superseded date

08-02-2021

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Describes the specifications for 300 mm wafer tape frames used between the dicing process and the die-bonding process.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Superseded
SupersededBy

SEMI G94:2013 SPECIFICATION FOR COIN-STACK TYPE TAPE FRAME SHIPPING CONTAINER FOR 300 MM WAFER
SEMI G77 : 1999(R2015) SPECIFICATION FOR FRAME CASSETTE FOR 300 MM WAFERS
SEMI E106 : 2004 OVERVIEW GUIDE TO SEMI STANDARDS FOR PHYSICAL INTERFACES AND CARRIERS FOR 300 MM WAFERS
SEMI 3D3:2013 GUIDE FOR MULTIWAFER TRANSPORT AND STORAGE CONTAINERS FOR 300 MM, THIN SILICON WAFERS ON TAPE FRAMES

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