SEMI G74:1999(R2020)
Current
Current
The latest, up-to-date edition.
Specification for Tape Frame for 300 mm Wafers
Available format(s)
Hardcopy
Language(s)
English
Published date
01-10-2020
The purpose of this Document is to standardize the specifications for 300 mm wafer tape frames used between the dicing process and the die-bonding process.
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