SEMI G77 : 1999(R2020)
Current
Current
The latest, up-to-date edition.
SEMI G77 - Specification for Frame Cassette for 300 mm Wafers
Published date
01-10-2020
Sorry this product is not available in your region.
The purpose of this Standard is to specify the mechanical features for a 300 mm wafer frame cassette used between the wafer mounting process and the die-bonding process.
| DocumentType |
Revision
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.