SEMI G77 : 1999(R2015)

Name: SEMI G77 : 1999(R2015)
Brand: SEMI

Superseded

SPECIFICATION FOR FRAME CASSETTE FOR 300 MM WAFERS

Superseded date

08-02-2021

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Describes the mechanical features for a 300 mm wafer frame cassette used between the wafer mounting process and the die-bonding process.

DevelopmentNote	Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType	Standard
PublisherName	Semiconductor Equipment & Materials Institute
Status	Superseded
SupersededBy	SEMI G77 : 1999(R2020)

SEMI E106 : 2004	OVERVIEW GUIDE TO SEMI STANDARDS FOR PHYSICAL INTERFACES AND CARRIERS FOR 300 MM WAFERS
SEMI G82 : 2015	SPECIFICATION FOR 300 MM LOAD PORT FOR FRAME CASSETTES IN BACKEND PROCESS

SEMI G74 : 1999(R2015)	SPECIFICATION FOR TAPE FRAME FOR 300 MM WAFERS
SEMI E1-9 : NOV 2006E	MECHANICAL SPECIFICATION FOR CASSETTES USED TO TRANSPORT AND STORE 300 MM WAFERS
SEMI E57 : 2000E2(R2010)	SPECIFICATION FOR KINEMATIC COUPLINGS USED TO ALIGN AND SUPPORT 300 MM WAFER CARRIERS
SEMI E15 : 1998E2(R2016)	SPECIFICATION FOR TOOL LOAD PORT
SEMI E47.1 : NOV 2006	MECHANICAL SPECIFICATION FOR FOUPS USED TO TRANSPORT AND STORE 300 MM WAFERS

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