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SEMI G77 : 1999(R2020)

Current

Current

The latest, up-to-date edition.

SEMI G77 - Specification for Frame Cassette for 300 mm Wafers

Published date

01-10-2020

The purpose of this Standard is to specify the mechanical features for a 300 mm wafer frame cassette used between the wafer mounting process and the die-bonding process.

DocumentType
Revision
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current
Supersedes

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