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SEMI G87 : 2008(R2015)

SEMI G87 : 2008(R2015)

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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SPECIFICATION FOR PLASTIC TAPE FRAME FOR 300 MM WAFER

Superseded date

08-02-2021

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Standardizes the specification of a plastic tape frame, for a 300 mm wafer, which is used between the dicing process and the die bonding process, and for the handling and shipping of wafers.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (10/2008)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Superseded
SupersededBy

SEMI G94:2013 SPECIFICATION FOR COIN-STACK TYPE TAPE FRAME SHIPPING CONTAINER FOR 300 MM WAFER
SEMI 3D3:2013 GUIDE FOR MULTIWAFER TRANSPORT AND STORAGE CONTAINERS FOR 300 MM, THIN SILICON WAFERS ON TAPE FRAMES

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