SEMI M31:2018
Current
Current
The latest, up-to-date edition.
Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers
Available format(s)
Hardcopy
Language(s)
English
Published date
04-08-2018
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
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