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SEMI M31 : 2008

SEMI M31 : 2008

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS

Superseded date

08-11-2018

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Describes the front-opening shipping box (FOSB) used to ship 300 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001) Also available in CD-ROM. (07/2006)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Superseded
SupersededBy

SEMI E146 : 2006 TEST METHOD FOR THE DETERMINATION OF PARTICULATE CONTAMINATION FROM MINIENVIRONMENTS USED FOR STORAGE AND TRANSPORT OF SILICON WAFERS
SEMI M38 : 2012(R2018) SPECIFICATION FOR POLISHED RECLAIMED SILICON WAFERS
SEMI T3 : 2013 SPECIFICATION FOR WAFER BOX LABELS
SEMI M45 : 2010(R2017) SPECIFICATION FOR 300 MM WAFER SHIPPING SYSTEM
SEMI E106 : 2004 OVERVIEW GUIDE TO SEMI STANDARDS FOR PHYSICAL INTERFACES AND CARRIERS FOR 300 MM WAFERS
SEMI E119 : JUL 2006(R2012) MECHANICAL SPECIFICATION FOR REDUCED-PITCH FRONT-OPENING BOX FOR INTERFACTORY TRANSPORT OF 300 MM WAFERS
SEMI 3D16 : 2016 SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING
SEMI 3D3:2013 GUIDE FOR MULTIWAFER TRANSPORT AND STORAGE CONTAINERS FOR 300 MM, THIN SILICON WAFERS ON TAPE FRAMES
SEMI E62 : NOV 2006(R2012) SPECIFICATION FOR 300 MM FRONT-OPENING INTERFACE MECHANICAL STANDARD (FIMS)
SEMI M49 : 2016 GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 16 NM TECHNOLOGY GENERATIONS
SEMI M52 : 2014 GUIDE FOR SPECIFYING SCANNING SURFACE INSPECTION SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 11 NM TECHNOLOGY GENERATIONS
SEMI 3D2 : 2016 SPECIFICATION FOR GLASS CARRIER WAFERS FOR 3DS-IC APPLICATIONS
SEMI M26 : 2004(R2010) GUIDE FOR THE RE-USE OF 100, 125, 150, AND 200 MM WAFER SHIPPING BOXES USED TO TRANSPORT WAFERS

SEMI E1-9 : NOV 2006E MECHANICAL SPECIFICATION FOR CASSETTES USED TO TRANSPORT AND STORE 300 MM WAFERS
SEMI E119 : JUL 2006(R2012) MECHANICAL SPECIFICATION FOR REDUCED-PITCH FRONT-OPENING BOX FOR INTERFACTORY TRANSPORT OF 300 MM WAFERS
SEMI M45 : 2010(R2017) SPECIFICATION FOR 300 MM WAFER SHIPPING SYSTEM
SEMI E62 : NOV 2006(R2012) SPECIFICATION FOR 300 MM FRONT-OPENING INTERFACE MECHANICAL STANDARD (FIMS)
SEMI E15-1 : 2005(R2010) SPECIFICATION FOR 300 MM TOOL LOAD PORT
SEMI E57 : 2000E2(R2010) SPECIFICATION FOR KINEMATIC COUPLINGS USED TO ALIGN AND SUPPORT 300 MM WAFER CARRIERS
SEMI E15 : 1998E2(R2016) SPECIFICATION FOR TOOL LOAD PORT
SEMI E47.1 : NOV 2006 MECHANICAL SPECIFICATION FOR FOUPS USED TO TRANSPORT AND STORE 300 MM WAFERS

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