SEMI MF928:2022
Current
The latest, up-to-date edition.
Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates
Hardcopy
English
01-06-2022
Important note : Users cannot be edited or removed once added to your Multi user PDF.The edges of circular wafers of electronic materials are frequently required to be shaped after cutting the wafers from the ingot. Contouring the wafer edge reduces the incidence of chipping and minimizes epitaxial edge crown and photoresist edge bead during subsequent processing of the wafer.
| DocumentType |
Test Method
|
| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
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