SEMI P24 : 1994(R2004)
Current
Current
The latest, up-to-date edition.
CD METROLOGY PROCEDURES
Published date
12-01-2013
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Establishes uniform procedures for metrology systems for the litho-metrology task. Also determines the performance of gauging/measurement systems for a very specific application the lithography section of integrated circuit wafer fabrication.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
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| Standards | Relationship |
| SAC GB/T 17864 : 1999 | Identical |
| SEMI P19 : 1992(R2007) | SPECIFICATION FOR METROLOGY PATTERN CELLS FOR INTEGRATED CIRCUIT MANUFACTURE |
| SEMI P10 : 2012 | SPECIFICATION OF DATA STRUCTURES FOR PHOTOMASK ORDERS |
| BS IEC 62899-301-2:2017 | Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension |
| SEMI P43 : 2004(R2011) | PHOTOMASK QUALIFICATION TERMINOLOGY |
| 14/30317965 DC : 0 | BS EN 62903-2 ED.1 - PRINTED ELECTRONICS - EQUIPMENT - CONTACT PRINTING - RIGID MASTER - PART 2: MEASUREMENT METHOD OF PLATE MASTER PATTERN DIMENSION |
| IEC 62899-301-2:2017 | Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension |
| SEMI E10 : 2014E | SPECIFICATION FOR DEFINITION AND MEASUREMENT OF EQUIPMENT RELIABILITY, AVAILABILITY, AND MAINTAINABILITY (RAM) AND UTILIZATION |
| SEMI P19 : 1992(R2007) | SPECIFICATION FOR METROLOGY PATTERN CELLS FOR INTEGRATED CIRCUIT MANUFACTURE |
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