SN EN 129000 : AMD 1 1995

Foreword
1 Scope
2 General
2.1 Related documents
2.2 Units, symbols and terminology
2.3 Preferred values
2.4 Marking
3 Quality assessment procedures
3.1 Qualification approval/Quality assessment systems
3.2 Primary stage of manufacture
3.3 Structurally similar components
3.4 Qualification approval procedures
3.5 Quality conformance inspection
3.6 Alternative test methods
3.7 Unchecked parameters
3.8 Manufacturing stages in a factory other than the
      approved manufacturer's and/or outside the
      geographical limits of CECC
4 Tests and measuring methods
4.1 General
4.2 Standard atmospheric conditions
4.3 Drying
4.4 Visual examination and check of dimensions
4.5 Insulation resistance
4.6 Voltage proof
4.7 Inductance
4.8 Q-factor
4.9 Self-resonant frequency
4.10 D.C. resistance
4.11 Robustness of terminations
4.12 Resistance to soldering heat
4.13 Solderability
4.14 Rapid change of temperature
4.15 Vibration
4.16 Bump
4.17 Shock
4.18 Sealing
4.19 Climatic sequence
4.20 Damp, heat, steady state
4.21 Temperature rise
4.22 Endurance
4.23 Change of inductance with current (superimposed
      direct current)
4.24 Component solvent resistance
4.25 Solvent resistance of marking
4.26 Passive flammability
4.27 Active flammability
Annex
A Interpretation of sampling plans and procedures as
      described in IEC 410 for use within the CECC System
      electronic components
Figure
1 Suitable insulation resistance and voltage proof
      test apparatus for surface mounting inductors

Applies to RF fixed wound inductors (with inductance values below 10 mH) to be used in electronic equipment. Gives terms, inspection procedures and test methods for sectional detail specifications with CECC System for electronic components.