Foreword
1 Scope
2 General
2.1 Related documents
2.2 Units, symbols and terminology
2.3 Preferred values
2.4 Marking
3 Quality assessment procedures
3.1 Qualification approval/Quality assessment systems
3.2 Primary stage of manufacture
3.3 Structurally similar components
3.4 Qualification approval procedures
3.5 Quality conformance inspection
3.6 Alternative test methods
3.7 Unchecked parameters
3.8 Manufacturing stages in a factory other than the
approved manufacturer's and/or outside the
geographical limits of CECC
4 Tests and measuring methods
4.1 General
4.2 Standard atmospheric conditions
4.3 Drying
4.4 Visual examination and check of dimensions
4.5 Insulation resistance
4.6 Voltage proof
4.7 Inductance
4.8 Q-factor
4.9 Self-resonant frequency
4.10 D.C. resistance
4.11 Robustness of terminations
4.12 Resistance to soldering heat
4.13 Solderability
4.14 Rapid change of temperature
4.15 Vibration
4.16 Bump
4.17 Shock
4.18 Sealing
4.19 Climatic sequence
4.20 Damp, heat, steady state
4.21 Temperature rise
4.22 Endurance
4.23 Change of inductance with current (superimposed
direct current)
4.24 Component solvent resistance
4.25 Solvent resistance of marking
4.26 Passive flammability
4.27 Active flammability
Annex
A Interpretation of sampling plans and procedures as
described in IEC 410 for use within the CECC System
electronic components
Figure
1 Suitable insulation resistance and voltage proof
test apparatus for surface mounting inductors