SN EN 165000-1 : 1996

1 General
1.1 Scope
1.2 Normative references
1.3 Units, symbols and terminology
1.4 Standard and preferred values
1.5 Marking
2 Quality assessment procedures
2.1 General
2.1.1 Eligibility for capability approval
2.1.2 Primary stage of manufacture
2.1.3 Subcontracting
2.1.4 Control of procurement sources and incoming
         material
2.1.5 Validity of release for delivery
2.1.6 Rework
2.2 Procedures for capability approval
2.2.1 Application for capability approval
2.2.2 Granting of capability approval
2.2.3 Description of capability
2.2.4 Capability qualifying components
2.2.5 Demonstration and verification of capability
2.2.6 Procedures to be followed in the event of CQC
         failures
2.2.7 Abstract of description of capability
2.3 Procedures following the granting of capability
         approval
2.3.1 Maintenance of capability approval
2.3.2 Notification of changes likely to affect the
         validity of capability approval
2.4 Release for delivery
2.4.1 General
2.4.2 Quality conformance inspection requirements
2.4.3 Detail specification
2.4.3(1) General
2.4.3(2) Customer detail specification
2.4.3(3) Detail specification for standard catalogue
         circuits to be included in the Qualified
         Products List (QPL)
3 Test and measurement procedures
3.1 General
3.2 Standard conditions for testing
3.3 Visual inspections and package dimensions
3.4 Electrical measurement procedures
3.5 Environmental test procedures
Figures
1 Definition of axis for mechanical and other tests
2 Pulling force for bond strength test
3 Apparatus requirements for the added component
         bond strength destructive test

Defines quality assessment procedures and test methods for use in assessing film and hybrid integrated circuit for use in electronic equipment, under the capability approval procedure. Also applies to part completed devices supplied to customers for subsequent processing. (Should be read with EN 165000 pts 2, 3 and 4)