SN EN 60068-2-54 : 2006
Current
The latest, up-to-date edition.
ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
12-01-2013
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the test
5 Description of the test apparatus
5.1 Test system
5.2 Solder bath
6 Preconditioning
6.1 Preparation of specimens
6.2 Ageing
7 Materials
7.1 Solder
7.2 Flux
8 Procedure
8.1 Test temperature
8.2 Fluxing
8.3 Flux drying
8.4 Test
9 Presentation of results
9.1 Form of chart-recorder trace
9.2 Points of significance
9.3 Reference wetting force
9.4 Test requirements
10 Information to be given in the relevant specification
Annex A (normative) Equipment specification
Annex B (informative) Guide to the use of the wetting balance
for solderability testing
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Describes Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.
| DocumentType |
Standard
|
| PublisherName |
Swiss Standards
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 60068-2-54:2007-01 | Identical |
| UNE-EN 60068-2-54:2007 | Identical |
| BS EN 60068-2-54:2006 | Identical |
| IEC 60068-2-54:2006 | Identical |
| EN 60068-2-54:2006 | Identical |
| I.S. EN 60068-2-54:2006 | Identical |
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