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SN EN 60191-6-4 : 2003

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING OF BALL GRID ARRAY (BGA)

Published date

12-01-2013

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1 Scope
2 Normative references
3 Terms and definitions
4 Reference character and drawings
   4.1 Ball grid array package (BGA) Type 1 - Ball datum
   4.2 Ball grid array package (BGA) Type 2 - Body datum
5 Measuring method
   5.1 Datum S pertaining to ball coplanarity
   5.2 Datum A, B
   5.3 Definition of specified dimensions and measuring method
   5.4 Profile of a package edge surface v
   5.5 Mounting height A
   5.6 First stand-off A1
   5.7 Second stand-off A4
   5.8 Ball diameter b
   5.9 Ball center position X
   5.10 Ball coplanarity y
   5.11 Package top flatness y1
Annex ZA: Normative references to international publications
         with their corresponding European publications

Includes requirements for the measuring methods of ball grid array (BGA) dimensions.

DocumentType
Standard
PublisherName
Swiss Standards
Status
Current

Standards Relationship
BS EN 60191-6-4:2003 Identical
EN 60191-6-4:2003 Identical
DIN EN 60191-6-4:2004-01 Identical
I.S. EN 60191-6-4:2003 Identical
IEC 60191-6-4:2003 Identical

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