SN EN 61189-3 : 1997 AMD 1 1999

Foreword
Introduction
1 Scope and object
2 Normative references
3 Accuracy, precision and resolution
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
9 M: Mechanical test methods
10 E: Electrical test methods
11 N: Environmental test methods
12: X: Miscellaneous test methods
Annex ZA (normative) Normative references to international
                     publications with their corresponding
                     European publications
Annex A (informative) Worked examples
Annex B (informative) Conversion table
Figure 1 - Measuring equipment for peel strength of
           flexible printed boards
Figure 2 - Plier fixture for thermal shock test, dip
           soldering
Figure 3 - Fluidized sand bath
Figure 4 - Figure deleted
Figure 5 - Figure deleted
Figure 6 - Suggested test specimen for surface mount
           features
Figure 7 - Suggested test specimen for plated through holes
Figure 8 - Rotary dip solderability test equipment
Figure 9 - Effectiveness of solder wetting of plated through
           holes
Figure 10 - Needle burner test
Figure 11 - Pencil holder
Figure 12 - Composite test pattern
Figure 13 - Test specimen
Table 1 - Student's "t" distribution
Table 2 - Table deleted
Table 3 - Table deleted
Table 4 - Accelerated ageing and test requirements
Table 5 - Maximum limits of solder bath contaminants

Describes methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.