SN EN 61191-2 : 1998
Current
The latest, up-to-date edition.
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION: REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
12-01-2013
Contents
Clause
1. General
1.1 Scope
1.2 Classification
1.3 Interpretation of requirements
2. Normative references
3. General requirements
4. Surface mounting of components
4.1 Alignment requirements
4.2 Surface mounted component requirements
4.3 Small devices with two terminations
4.4 Lead component body positioning
4.5 Parts configured adhesive coverage limits
5. Acceptance requirements
5.1 Control and corrective actions
5.2 Surface soldering of leads and terminations
5.3 General post soldering requirements applicable to
all surface-mounted assemblies
6. Rework and repair
Annex A (normative) Placement requirements for surface mounted
devices
Annex ZA Normative references to international publications
with their corresponding European publications
Gives the requirements for surface mounted solder connections. These pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other relating technologies (e.g. through-hole, terminal mounting, chip mounting, etc.).
DocumentType |
Standard
|
PublisherName |
Swiss Standards
|
Status |
Current
|
Standards | Relationship |
IEC 61191-2:2017 | Identical |
EN 61191-2:2017 | Identical |
I.S. EN 61191-2:2013 | Identical |
DIN EN 61191-2:2016-01 (Draft) | Identical |
NF EN 61191-2 : 2014 | Identical |
NBN EN 61191-2 : 2013 | Identical |
I.S. EN 61191-2:2017 | Identical |
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