EN 61191-2:2017

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Surface mounting of components
6 Acceptance requirements
7 Rework and repair
Annex A (normative) - Placement requirements
        for surface mounted devices
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).This edition includes the following significant technical changes with respect to the previous edition:a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;b) some of the terminology used in the document has been updated;c) references to IEC standards have been corrected;d) five termination styles have been added.