SN EN 62326-4 : 1997
Current
The latest, up-to-date edition.
PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION
12-01-2013
1 Scope
2 Normative references
3 General
4 Capability approval and maintenance of capability
approval
5 Test specimens
6 Test sequences
7 Quality assessment
8 Customer Detail Specification (CDS) data
9 Characteristics of printed boards
10 Capability test programme
11 Quality conformance inspection
12 Test specimens
Figures
1 Resin smear at interface
2 Circumferential defects
3 Conductor pattern defects
4 Minimum annular width (W1) of external land
5 Minimum annular width (W2) of internal land
6 Hole break-out
7 Examples of soldered holes
Annexes
A Acronyms related to IECQ and their explanations
B Conversion table
C Bibliography
ZA Normative references to international publications with
their corresponding European publications
Applies to rigid multilayer printed boards whatever the method of manufacture and forms the basis for agreements between manufacturer and user.
| DocumentType |
Standard
|
| PublisherName |
Swiss Standards
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 62326-4:1997-08 | Identical |
| UNE-EN 62326-4:1999 | Identical |
| I.S. EN 62326-4:1998 | Identical |
| IEC 62326-4:1996 | Identical |
| BS EN 62326-4:1997 | Identical |
| EN 62326-4:1997 | Identical |
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