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  • BS EN 62326-4:1997

    Current The latest, up-to-date edition.

    Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  15-06-1997

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 General
    4 Capability approval and maintenance of capability
        approval
    5 Test specimens
    6 Test sequences
    7 Quality assessment
    8 Customer Detail Specification (CDS) data
    9 Characteristics of printed boards
    10 Capability test programme
    11 Quality conformance inspection
    12 Test specimens
    Figures
    1 Resin smear at interface
    2 Circumferential defects
    3 Conductor pattern defects
    4 Minimum annular width (W1) of external land
    5 Minimum annular width (W2) of internal land
    6 Hole break-out
    7 Examples of soldered holes
    Annexes
    A Acronyms related to IECQ and their explanations
    B Conversion table
    C Bibliography
    ZA Normative references to international publications with
        their corresponding European publications

    Abstract - (Show below) - (Hide below)

    Applies to rigid multilayer printed boards whatever the method of manufacture and forms the basis for agreements between manufacturer and user.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Also numbered as IEC 62326-4 and QC 230500. (09/2005)
    Document Type Standard
    Publisher British Standards Institution
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
    EN 61249-5-1:1996 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
    IEC 61249-2-11:2003 Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
    IEC 61188-1-1:1997 Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
    EN 62326-4-1:1997 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C
    IEC 62326-1:2002 Printed boards - Part 1: Generic specification
    IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
    IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
    HD 323.2.3 : 200S2 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE
    IEC 61249-4-11:2005 Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
    IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    IEC 61249-2-9:2003 Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
    EN 62326-1:2002 Printed boards - Part 1: Generic specification
    IEC 61249-8-7:1996 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
    HD 323.2.38 : 200S1 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TESTS Z/AD: COMPOSITE TEMPERATURE/HUMIDITY CYCLIC TEST
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