UNE-EN 60191-6-4:2003
Current
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (Endorsed by AENOR in October of 2003.)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-10-2003
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
CTN 209/SC 47
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Asociacion Espanola de Normalizacion
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60191-6-4:2003 | Identical |
| EN 60191-6-4:2003 | Identical |
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