UNE-EN 60749-20-1:2009
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface mount devices sensitive to the combined effect of moisture and soldering heat (Endorsed by AENOR in September of 2009.)
Amended by
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-09-2009
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
CTN 209/SC 47
|
| DocumentType |
Standard
|
| Pages |
35
|
| ProductNote |
THIS STANDARD ALSO REFERS TO IPC/JEDEC J-STD-033
|
| PublisherName |
Asociacion Espanola de Normalizacion
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60749-20-1:2009 | Identical |
| EN 60749-20-1 : 2009 | Identical |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.