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UNE-EN 60749-20-1:2009

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface mount devices sensitive to the combined effect of moisture and soldering heat (Endorsed by AENOR in September of 2009.)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-09-2009

Committee
CTN 209/SC 47
DocumentType
Standard
Pages
35
ProductNote
THIS STANDARD ALSO REFERS TO IPC/JEDEC J-STD-033
PublisherName
Asociacion Espanola de Normalizacion
Status
Current

Standards Relationship
IEC 60749-20-1:2009 Identical
EN 60749-20-1 : 2009 Identical

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