UNE-EN IEC 61190-1-3:2018
Current
The latest, up-to-date edition.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.)
Hardcopy , PDF
English
01-04-2018
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for special electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process
Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc.
| Committee |
CTN 203/SC 91-119
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-5127-0
|
| Pages |
52
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61190-1-3:2017 | Identical |
| IEC 61190-1-3:2007 | Identical |
| EN IEC 61190-1-3:2018 | Identical |
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