12/30261600 DC : DRAFT MAR 2012

Superseded

Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES

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Superseded date: 31-07-2015

Language(s):

Published date: 23-11-2012

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BS EN 61760-4

Comment Closes On
Committee	EPL/501
Document Type	Draft
ISBN
Pages
Published
Publisher	British Standards Institution
Status	Superseded
Superseded By	BS EN 61760-4 : 2015

IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IPC SM 786 : A1995	PROCEDURES FOR CHARACTERIZING AND HANDLING OF MOISTURE/REFLOW SENSITIVE ICs
MIL-PRF-131 Revision K:2005	BARRIER MATERIALS, WATERVAPORPROOF, GREASEPROOF, FLEXIBLE, HEAT-SEALABLE
IPC J STD 033C-1:2014	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IEC 61760-2:2007	Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
MIL-PRF-27401 Revision G:2013	Propellant Pressurizing Agent, Nitrogen
ISO 62:2008	Plastics Determination of water absorption
ASTM D 570 : 1998 : R2018	Standard Test Method for Water Absorption of Plastics

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BS EN 61760-4

Comment Closes On
Committee	EPL/501
Document Type	Draft
ISBN
Pages
Published
Publisher	British Standards Institution
Status	Superseded
Superseded By	BS EN 61760-4 : 2015

IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IPC SM 786 : A1995	PROCEDURES FOR CHARACTERIZING AND HANDLING OF MOISTURE/REFLOW SENSITIVE ICs
MIL-PRF-131 Revision K:2005	BARRIER MATERIALS, WATERVAPORPROOF, GREASEPROOF, FLEXIBLE, HEAT-SEALABLE
IPC J STD 033C-1:2014	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IEC 61760-2:2007	Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
MIL-PRF-27401 Revision G:2013	Propellant Pressurizing Agent, Nitrogen
ISO 62:2008	Plastics Determination of water absorption
ASTM D 570 : 1998 : R2018	Standard Test Method for Water Absorption of Plastics