IPC J STD 020D-1:2008
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-03-2008
Publisher
Superseded date
04-02-2018
Superseded by
Excluding VAT
1 PURPOSE
2 APPLICABLE DOCUMENTS
3 APPARATUS
4 CLASSIFICATION/RECLASSIFICATION
5 PROCEDURE
6 CRITERIA
7 MOISTURE/REFLOW SENSITIVITY
CLASSIFICATION
8 OPTIONAL WEIGHT GAIN/LOSS ANALYSIS
9 ADDITIONS AND EXCEPTIONS
ANNEX A
ANNEX B
Pertains to all nonhermetic SMDs in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow.
| DevelopmentNote |
Supersedes IPC SM 786 and EIA JESD 22 A112. Included in IPC C 103 & IPC C 1000. (10/2012) Jointly published by IPC & JEDEC. D.1 2008 Edition is still available in Russian Language See separate records. Also available in Chinese Language, See J STD 020 CHINESE. (05/2016) Also available in Hardcopy format. (01/2018)
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| DocumentType |
Standard
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| Pages |
24
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC PAS 62190:2000 | Identical |
| 17/30357139 DC : 0 | BS EN 61760-4 + A1 - SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| IPC J STD 035 : 0 | ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS |
| GEIA SSB 1.002 : 1999 | ENVIRONMENTAL TESTS AND ASSOCIATED FAILURE MECHANISMS |
| BS EN 62258-1:2010 | Semiconductor die products Procurement and use |
| SAE AS6171/11 | Techniques for Suspect/Counterfeit EEE Parts Detection by Design Recovery Test Methods |
| SAE J1211_201211 | Handbook for Robustness Validation of Automotive Electrical/Electronic Modules |
| I.S. EN 62258-1:2010 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
| IEC 62090:2017 | Product package labels for electronic components using bar code and two-dimensional symbologies |
| I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| PD IEC/TS 62861:2017 | Guidelines for principal component reliability testing for LED light sources and LED luminaires |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| EN 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| EN 62047-20:2014 | Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes |
| EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| IPC 9504 : 0 | ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS) |
| IPC 9502 : 0 | PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| DSCC 13031 : A | FUSE, INSTRUMENT, SUBMINIATURE |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| 11/30243259 DC : 0 | BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| VDA 4992-1 : 2015 | VDA MAT LABEL |
| 12/30256751 DC : 0 | BS EN 62047-20 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES |
| I.S. EN 62047-20:2014 | SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES |
| SAE AS6294/2 | Requirements for Plastic Encapsulated Microcircuits in Military and Avionics Applications |
| CEI EN 61760-4 : 2016 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| IPC 1756 : 2010 | MANUFACTURING PROCESS DATA MANAGEMENT |
| IEC PAS 60191-6-19:2008 | Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage |
| IEC TS 62239:2008 | Process management for avionics - Preparation of an electronic components management plan |
| PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
| IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| DD IEC PAS 62050 : DRAFT 2004 | BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| ANSI C78.374 : 2015 | AMERICAN NATIONAL STANDARD FOR ELECTRIC LAMPS - LIGHT-EMITTING DIODE PACKAGE SPECIFICATION SHEET FOR GENERAL ILLUMINATION APPLICATIONS |
| I.S. EN 62435-2:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
| BS EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| IEC 61760-4:2015 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
| SAE AS6171/6 | Techniques for Suspect/Counterfeit EEE Parts Detection by Acoustic Microscopy (AM) Test Methods |
| SAE J1879_201402 | Handbook for Robustness Validation of Semiconductor Devices in Automotive Applications |
| ETSI TS 102 671 V9.2.0 (2015-06) | Smart Cards; Machine to Machine UICC; Physical and logical characteristics (Release 9) |
| IPC 9631 : 0 | USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION |
| IEC TS 62239-1:2015 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| EN 61760-4:2015/A1:2018 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
| BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
| IEC PAS 62686-1:2011 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| GEIA STD 0006 : 2008 | REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| EIA STD 4899 : 2017-05 | REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
| GEIA SSB 1.001 : 1999 | QUALIFICATION AND RELIABILITY MONITORS |
| NASA MSFC STD 3012 : 2012 | ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
| NASA JSC 66491 : 2013 | STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP) |
| IPC J STD 075 : 0 | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
| EIA 4899 : 2001 | STANDARD FOR PREPARING AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| IEC PAS 62168:2000 | Symbols and labels for moisture-sensitive devices |
| BS EN 62435-2:2017 | Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms |
| MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
| BS EN 60068-3-13:2016 | Environmental testing Supporting documentation and guidance on Test T. Soldering |
| DD IEC/TS 62239:2003 | Process management for avionics. Preparation of an electronic components management plan |
| IEC PAS 62239:2001 | Electronic component management plans |
| DSCC 14001 : 0 | FUSE, INSTRUMENT, SUBMINIATURE |
| IEC PAS 62686-2:2016 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components |
| IEC 62047-20:2014 | Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes |
| BS EN 16602-60-13:2015 | Space product assurance. Requirements for the use of COTS components |
| IEC PAS 62050:2004 | Board level drop test method of components for handheld electronic products |
| I.S. EN 60068-3-13:2016 | ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| 17/30365636 DC : 0 | BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
| PD IEC/TS 62239-1:2015 | Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan |
| PD IEC/PAS 62686-2:2016 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for passive components |
| IEC TS 62647-23:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| PD IEC/TS 62647-23:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| DD IEC PAS 62686-1 : DRAFT JULY 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
| IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| IEC 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| DD IEC PAS 62647-23 : DRAFT AUG 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| EN 16602-60-13:2015 | Space product assurance - Requirements for the use of COTS components |
| SAE AS6294/1 | Requirements for Plastic Encapsulated Microcircuits in Space Applications |
| 12/30261600 DC : DRAFT MAR 2012 | BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| MIL-PRF-38534 Revision K:2017 | Hybrid Microcircuits, General Specification for |
| BS EN 62047-20:2014 | Semiconductor devices. Micro-electromechanical devices Gyroscopes |
| MIL-PRF-19500-672 Base Document:2001 | Transistor, NPN, Silicon, Switching, Non-Hermetic (Plastic Encapsulated), Surface Mount, Type 2N2222A Quality Levels JANP and JANPTX |
| MIL-PRF-19500-686 Base Document:2001 | Semiconductor Device, Transistor, Plastic, PNP, Silicon, Switching, Type 2N2907AUE1 JAN, JANTX, JANJ |
| MIL-PRF-19500-695 Base Document:2001 | Semiconductor Device, Transistor, Plastic, PNP, Silicon, Switching, Type 2N4033UE1 JAN, JANTX, JANJ |
| BS EN 61760-4 : 2015 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| I.S. EN 61760-4:2015 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| IEEE 2700-2014 | IEEE Standard for Sensor Performance Parameter Definitions |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| I.S. EN 60068-2-58:2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| IEC TS 62861:2017 | Guidelines for principal component reliability testing for LED light sources and LED luminaires |
| CEI EN 62258-1 : 2011 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
| EN 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 60068-2-58:2015/A1:2018 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
| EN 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| JEDEC JESD22-A111C:2025 | Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices |
| IPC 9503 : 0 | MOISTURE SENSITIVITY CLASSIFICATION FOR NON-IC COMPONENTS |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC J STD 035 : 0 | ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS |
| IPC J STD 075 : 0 | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
Summarise