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  • DIN EN 60191-6-1:2002-08

    Current The latest, up-to-date edition.

    MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; DESIGN GUIDE FOR GULL-WING LEAD TERMINALS

    Available format(s):  Hardcopy, PDF

    Language(s):  German

    Published date:  01-01-2002

    Publisher:  German Institute for Standardisation (Deutsches Institut für Normung)

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Definitions
    4 References and drawings
    5 Outline dimensions
    6 Package height and stand-off height
    7 Terminal thickness and width
    8 Terminal shape
    9 Tolerance of terminal center position and coplanarity
    Annex ZA (normative) Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Provides the requirements for the design rule of terminal shape plastic packages with gull-wing leads; QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes DIN IEC 47D-255-CDV (08/2002)
    Document Type Standard
    Publisher German Institute for Standardisation (Deutsches Institut für Normung)
    Status Current
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