EN 60191-6-1:2001

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Current The latest, up-to-date edition.

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

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Published date: 11-12-2001

Publisher: European Committee for Standards - Electrical

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FOREWORD
1 Scope
2 Normative references
3 Definitions
4 References and drawings
5 Outline dimensions
6 Package height and stand-off height
7 Terminal thickness and width
8 Terminal shape
9 Tolerance of terminal center position and coplanarity
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications

Abstract - (Show below) - (Hide below)

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

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Committee	CLC/SR 47D
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Current

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Equivalent Standard(s)	Relationship
IEC 60191-6-1:2001	Identical
NBN EN 60191 6-1 : 2002	Identical
NEN EN IEC 60191-6-1 : 2002	Identical
I.S. EN 60191-6-1:2002	Identical
PN EN 60191-6-1 : 2003	Identical
UNE-EN 60191-6-1:2002	Identical
BS EN 60191-6-1:2001	Identical
CEI EN 60191-6-1 : 2003	Identical
DIN EN 60191-6-1:2002-08	Identical
NF EN 60191-6-1 : 2002	Identical

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EN IEC 60191-1:2018	Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
I.S. EN IEC 60191-1:2018	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES

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IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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