• I.S. EN 60191-6-1:2002

    Current The latest, up-to-date edition.

    MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES DESIGN GUIDE FOR GULL-WING LEAD TERMINALS

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2002

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Definitions
    4 References and drawings
    5 Outline dimensions
    6 Package height and stand-off height
    7 Terminal thickness and width
    8 Terminal shape
    9 Tolerance of terminal center position and coplanarity
    Annex ZA (normative) Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Provides the requirements for the design rule of terminal shape plastic packages with gull-wing leads; QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4.

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    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
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