• IEC 60191-6-1:2001

    Current The latest, up-to-date edition.

    MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GULL-WING LEAD TERMINALS

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English

    Published date:  29-10-2001

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative reference
    3 Definitions
    4 References and drawings
    5 Outline dimensions
    6 Package height and stand-off height
    7 Terminal thickness and width
    8 Terminal shape
    9 Tolerance of terminal center position and co-planarity
    Table

    Abstract - (Show below) - (Hide below)

    Provides the requirements for the design rule of terminal shape plastic packages with gull-wing leads; QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47
    Development Note Also numbered as BS EN 60191-6-1. (05/2002) Stability Date: 2021. (10/2012)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN IEC 60191-1 : 2018 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES (IEC 60191-1:2018)
    17/30352677 DC : 0 BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN
    I.S. EN IEC 60191-1:2018 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
    IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
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