IEC 62137-1-5 : 1.0

Current

Current The latest, up-to-date edition.

SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS - PART 1-5: MECHANICAL SHEAR FATIGUE TEST

Available format(s): Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

Language(s): English - French

Published date:

Publisher: International Electrotechnical Committee

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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment and materials
  4.1 Test equipment for mechanical shear fatigue testing
  4.2 Test substrate
  4.3 Solder alloy
  4.4 Solder paste
  4.5 Reflow soldering equipment
5 Mounting
6 Test conditions
  6.1 Pre-treatment
  6.2 Test procedures
  6.3 Judging criteria
7 Items to be included in the test report
8 Items to be given in the product specification
Annex A (normative) Mechanical shear fatigue test
        equipment
Annex B (normative) Mechanical shear fatigue test
        procedure
Annex C (informative) Evaluation of mechanical properties
        of a single solder joint by mechanical shear
        fatigue test
Bibliography

Abstract - (Show below) - (Hide below)

Describes a test method that applies to area array packages, such as BGA.

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Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Development Note	Stability Date: 2020. (09/2017)
Pages
ISBN
Committee	TC 91

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
DS EN 62137-1-5 : 2009	Identical
NF EN 62137-1-5 : 2009	Identical
NEN EN IEC 62137-1-5 : 2009	Identical
I.S. EN 62137-1-5:2009	Identical
PN EN 62137-1-5 : 2009	Identical
UNE-EN 62137-1-5:2009	Identical
BS EN 62137-1-5 : 2009	Identical
CEI EN 62137-1-5 : 2010	Identical
EN 62137-1-5 : 2009	Identical
DIN EN 62137-1-5:2010-01	Identical
CEI EN 62137-1-5 : 2010	Identical
BS EN 62137-1-5 : 2009	Identical
PN EN 62137-1-5 : 2009	Identical
DS EN 62137-1-5 : 2009	Identical
NEN EN IEC 62137-1-5 : 2009	Identical
I.S. EN 62137-1-5:2009	Identical
DIN EN 62137-1-5:2010-01	Identical
UNE-EN 62137-1-5:2009	Identical
JIS C 62137-1-5:2011	Identical
NF EN 62137-1-5 : 2009	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS EN 62137-3 : 2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
DD IEC PAS 62137-3 : DRAFT 2008	ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
09/30206176 DC : DRAFT JUNE 2009	BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
NF EN 62137-3 : 2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
CEI EN 62137-3 : 2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
I.S. EN 62137-3:2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV))
IEC PAS 62137-3 : 1.0	ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
IEC 62137-3 : 1.0	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60068-1 : 7.0	ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE
IEC 61190-1-2 : 3.0	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
IEC 61249-2-7 : 1.0	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC 61188-5-8 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
IEC 60068-2-21 : 6.0	ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
IEC 61760-1 : 2.0	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 60194 : 6.0	PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
IEC 61190-1-3 : 2.1	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

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IEC 62137-1-5 : 1.0

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