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  • IPC 7530 : 0

    Current The latest, up-to-date edition.

    GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)

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    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 CONVECTION REFLOW PROFILING
    4 VAPOR-PHASE REFLOW PROFILING
    5 WAVE SOLDERING PROFILING
    6 SELECTIVE SOLDERING PROFILING
    7 TEMPERATURE PROFILING TOOLS
    8 TROUBLESHOOTING

    Abstract - (Show below) - (Hide below)

    Specifies thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow and wave soldering.

    General Product Information - (Show below) - (Hide below)

    Development Note 2001 Edition are still available in Chinese & Hungarian Languages, See IPC 7530 CHINESE & IPC 7530 HUNGARIAN. (05/2017) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 7801 : 0 REFLOW OVEN PROCESS CONTROL STANDARD
    IPC J STD 001 SWEDISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 RUSSIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 HUNGARIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC TR 460 : A1984 TROUBLE-SHOOTING CHECKLIST FOR WAVE SOLDERING PRINTED WIRING BOARDS
    IPC 7351 GERMAN : B Basic requirements for SMT design and SMD patch guideline
    IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 DANISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 9631 : 0 USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION
    DD IEC/PAS 62483:2006 Test method for measuring whisker growth on tin and tin alloy surface finishes
    IEC PAS 62483:2006 Test method for measuring whisker growth on tin and tin alloy surface finishes
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