Skip to content
Please enter a keyword to search

  • IPC 7351 GERMAN : B

    Current The latest, up-to-date edition.

    Basic requirements for SMT design and SMD patch guideline

    Available format(s): 

    Language(s): 

    Published date:  30-06-2010

    Publisher:  Institute of Printed Circuits

    Sorry this product is not available in your region.

    Add To Cart

    Abstract - (Show below) - (Hide below)

    Dieses Dokument enthält Informationen über die Geome-trien der Anschlussflächen-Bilder (Land Pattern) für die Oberflächenmontage elektronischer Bauelemente. Ziel der gegebenen Informationen ist es, Angaben über die geeignete Grösse, Form und Toleranz der Anschlussflächen-Bilder für oberflächenmontierte Bauelemente an die Hand zu geben, um sicherzustellen, dass eine ausreichende Fläche zur Ausbildung von Lotmenisken zur Verfügung steht, die den Anforderungen der IPC J-STD-001 entspricht.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC S 816 : 0 SMT PROCESS GUIDELINE AND CHECKLIST
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC 4761 : 0 DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 2226 : 0 SECTIONAL DESIGN STANDARD FOR HIGH DENSITY INTERCONNECT (HDI) PRINTED BOARDS
    IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 7530 : 0 GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)
    IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 1902 : 1998 GRID SYSTEMS FOR PRINTED CIRCUITS
    IPC 7525 : B STENCIL DESIGN GUIDELINES
    IPC 7711/21 : B REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
    IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
    IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
    IPC SM 785 : 0 GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS
    IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective