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  • IPC 9631 : 0

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION

    Available format(s):  Hardcopy

    Superseded date:  15-05-2016

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 EXECUTIVE SUMMARY
    2 APPLICABLE DOCUMENTS
    3 HISTORICAL BACKGROUND
    4 PRECONDITIONING CONSIDERATIONS
    5 PROFILE DEVELOPMENT/OVEN SETUP
    6 PROFILE VERIFICATION
    7 PHYSICS OF METHOD 2.6.27
    8 SUMMARY

    Abstract - (Show below) - (Hide below)

    Specifies how the test method is intended for use and the rationale behind some of the protocols and requirements.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in IPC C 1000. (12/2010) Also available in German Language, See IPC 9631 GERMAN. (04/2013)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC 7530 : 0 GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)
    IPC 1601 : 0 PRINTED BOARD HANDLING AND STORAGE GUIDELINES
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