IPC 7351 : B

1 SCOPE
2 APPLICABLE DOCUMENTS
3 DESIGN REQUIREMENTS
4 COMPONENT QUALITY VALIDATION
5 TESTABILITY
6 PRINTED BOARD STRUCTURE TYPES
7 ASSEMBLY CONSIDERATION FOR SURFACE MOUNT TECHNOLOGY (SMT)
8 IPC-7352 DISCRETE COMPONENTS
9 IPC-7353 GULLWING LEADED COMPONENTS, TWO SIDES
10 IPC-7354 J-LEADED COMPONENTS, TWO SIDES
11 IPC-7355 GULL-WING LEADED COMPONENTS, FOUR SIDES
12 IPC-7356 J LEADED COMPONENTS, FOUR SIDES
13 IPC-7357 POST (DIP) LEADS, TWO SIDES
14 IPC-7358 AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA,
   Chip Array)
15 IPC-7359 NO-LEAD COMPONENTS (QFN, PQFN, SON, PSON, LCC)
16 ZERO COMPONENT ORIENTATIONS
APPENDIX A (INFORMATIVE) - TEST PATTERNS - PROCESS EVALUATIONS
APPENDIX B - IPC-7351 LAND PATTERN CALCULATOR

Defines land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. Also specifies printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.