IPC 7351 : B
Current
The latest, up-to-date edition.
GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
Hardcopy , PDF
Chinese, English, German
30-06-2010
1 SCOPE
2 APPLICABLE DOCUMENTS
3 DESIGN REQUIREMENTS
4 COMPONENT QUALITY VALIDATION
5 TESTABILITY
6 PRINTED BOARD STRUCTURE TYPES
7 ASSEMBLY CONSIDERATION FOR SURFACE MOUNT TECHNOLOGY (SMT)
8 IPC-7352 DISCRETE COMPONENTS
9 IPC-7353 GULLWING LEADED COMPONENTS, TWO SIDES
10 IPC-7354 J-LEADED COMPONENTS, TWO SIDES
11 IPC-7355 GULL-WING LEADED COMPONENTS, FOUR SIDES
12 IPC-7356 J LEADED COMPONENTS, FOUR SIDES
13 IPC-7357 POST (DIP) LEADS, TWO SIDES
14 IPC-7358 AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA,
Chip Array)
15 IPC-7359 NO-LEAD COMPONENTS (QFN, PQFN, SON, PSON, LCC)
16 ZERO COMPONENT ORIENTATIONS
APPENDIX A (INFORMATIVE) - TEST PATTERNS - PROCESS EVALUATIONS
APPENDIX B - IPC-7351 LAND PATTERN CALCULATOR
Defines land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. Also specifies printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.
| DevelopmentNote |
Included in IPC C 106, IPC C 103, IPC C 105 & IPC C 1000. (07/2009) Also available in German Language, See IPC 7351 GERMAN. (11/2011) Supersedes IPC SM 782 & IPC 7351 CD. (05/2016)
|
| DocumentType |
Standard
|
| ISBN |
978-1-61193-013-9
|
| Pages |
116
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| Supersedes |
| BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
| PD IEC/PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
| EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IPC 1756 : 2010 | MANUFACTURING PROCESS DATA MANAGEMENT |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| IEC PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC 2584 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
| IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| BS IEC 61182-2:2006 | Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| I.S. EN 16602-70-12:2016 | SPACE PRODUCT ASSURANCE - DESIGN RULES FOR PRINTED CIRCUIT BOARDS |
| IPC 4761 : 0 | DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 7530 : 0 | GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE) |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 7525 : B | STENCIL DESIGN GUIDELINES |
| IPC 7711/21 : B | REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |