• IPC L 108 : B

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS

    Available format(s): 

    Superseded date:  01-03-1998

    Language(s): 

    Published date:  23-11-2012

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Covers the requirement for high-temperature, fully-cured, metal-clad, thin laminated plastic sheets, to be used primarily for high-temperature multilayered and thin printed boards for electrical and electronic circuits. This specification applies to sheets when the base laminate does not exceed 0.79mm (0.031 inch) in nominal thickness. Recognizes that printed boards are subject to classifications by intended end-item usage. Thus, where applicable, for ordering purposes the multilayer printed board laminate material is specified.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    RC.AERO 54407 : 1981 MATERIALS FOR SINGLE AND DOUBLE SIDED PRINTED CIRCUIT BOARDS
    IPC ML 950 : C1980 RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR,
    IPC D 949 : 1987 RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR,
    IPC CC 110 : A 1997 GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC L 115 : B SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS
    IPC L 112 : A92 SPECIFICATION FOR COMPOSITE METAL CLAD BASE MATERIALS FOR PRINTED BOARDS
    IPC L 109 : B SPECIFICATION FOR RESIN PREIMPREGNATED FABRIC (PREPREG) FOR MULTILAYER PRINTED BOARDS
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