IPC L 115 : B
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS
Available format(s)
PDF
Language(s)
English
Published date
12-01-2013
Publisher
Superseded date
01-12-1997
Superseded by
Excluding VAT
Covers the requirements for high-temperature performance, metal-clad, fully-cured, laminated plastic sheets, to be used primarily for the fabrication of printed wiring boards for electrical and electronic circuits. Applies to sheets when the laminate is 0.79mm (0.031 inch) or greater in nominal overall thickness.
| DocumentType |
Standard
|
| Pages |
80
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IPC L 108 : B | SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS |
| IPC ML 950 : C1980 | RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR, |
| IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
| IPC CC 110 : A 1997 | GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS |
| IPC D 319 : 1987 | DESIGN STANDARD FOR RIGID SINGLE AND DOUBLE-SIDED PRINTED BOARDS |
| IPC RF 245 : 1987 | RIGID-FLEX PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR, |
| IPC MC 324 : 1988 | PERFORMANCE SPECIFICATIONS FOR METAL CORE BOARDS |
| IPC SD 320 : B1986 | PERFORMANCE SPECIFICATION FOR RIGID SINGLE AND DOUBLE-SIDED PRINTED BOARDS |
| IPC BP 421 : 80(R1990) | GENERAL SPECIFICATION FOR RIGID PRINTED BOARD BACKPLANES WITH PRESS-FIT CONTACTS |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC FC 150 : E | COPPER FOIL FOR PRINTED WIRING APPLICATIONS |
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