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  • IPC 4101 : D

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS

    Available format(s):  Hardcopy

    Superseded date:  15-11-2019

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS
    4 QUALITY ASSURANCE PROVISIONS
    5 PREPARATION FOR DELIVERY
    6 NOTES
    7 KEYWORDS
    APPENDIX A - (IPC-4101 supplemental inspection
                 requirements if required in purchase
                 order or master drawing)

    Abstract - (Show below) - (Hide below)

    Includes the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.

    General Product Information - (Show below) - (Hide below)

    Committee 3-10
    Development Note Supersedes IPC L 108, IPC L 109, IPC L 112, IPC L 115 & IPC AM 361. Included in IPC C 107, IPC C 105 & IPC C 1000. (07/2009) C2009 Edition is still available in Chinese & German Languages, See IPC 4101 CHINESE & IPC 4101 GERMAN respectively. (05/2014) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC PAS 63015:2016 Definition of "Low-Halogen" for electronic products
    BS EN 16602-70-10:2015 Space product assurance. Qualification of printed circuit boards
    PD IEC/PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
    IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
    PD IEC/PAS 61249-8-1:2014 Qualification and performance of electrical insulating compound for printed wiring assemblies
    BS EN 50155:2017 Railway applications. Rolling stock. Electronic equipment
    16/30282633 DC : 0 BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK
    IPC 2222 GERMAN : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC 2222 FRENCH : A2010 SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC 2224 : 0 SECTIONAL STANDARD FOR DESIGN OF PWBS FOR PC CARDS
    IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 4821 : 0 SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC 4130 : 0 SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN 'E' GLASS MATERIALS
    IPC 2223 CHINESE : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
    IPC 7093 CHINESE : - DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC D 330 : 1992 DESIGN GUIDE MANUAL
    IPC CF 152 : B COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
    IPC 2222 CHINESE : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC WP/TR 584 : A IPC WHITE PAPER AND TECHNICAL REPORT ON THE USE OF HALOGENATED FLAME RETARDANTS IN PRINTED CIRCUIT BOARDS AND ASSEMBLIES
    IPC 4110 : 0 SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN CELLULOSE BASED PAPER FOR PRINTED BOARDS
    MIL-DTL-7788 Revision H:2011 PANELS, INFORMATION, INTEGRALLY ILLUMINATED
    IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
    IPC 4412 : B SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS
    IPC 2223 GERMAN : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
    IPC TA 720 : 1986 TECHNOLOGY ASSESSMENT HANDBOOK ON LAMINATES
    IPC 4412 CHINESE : B SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS
    IPC J STD 609 CHINESE : A IPC/JEDEC MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    IPC TR 468 : 1979 FACTORS AFFECTING INSULATION RESISTANCE PERFORMANCE OF PRINTED BOARDS
    IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 2141 : A DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS
    IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
    IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
    I.S. EN 16602-70-11:2015 SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS
    I.S. EN 16602-70-10:2015 SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS
    IEC PAS 62647-23:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    I.S. EN 50155:2017-11 RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT
    IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC-A-22:1996 Gerber Coupon Generator
    GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    IEC PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    IPC J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    NASA MSFC STD 2907 : 2006 WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS
    EN 50155:2017 Railway applications - Rolling stock - Electronic equipment
    MIL-STD-202-210 Base Document:2015 METHOD 210, RESISTANCE TO SOLDERING HEAT
    IEC PAS 62588:2008 Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
    IEC TS 62647-23:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    DD IEC/PAS 62588:2008 Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
    PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
    IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
    PD IEC/PAS 63015:2016 Definition of “Low-Halogen?? for electronic products
    12/30262664 DC : DRAFT APR 2012 BS EN 62588 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    DD IEC PAS 62647-23 : DRAFT AUG 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
    BS IEC 61182-2:2006 Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements
    BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
    EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
    EN 16602-70-10:2015 Space product assurance - Qualification of printed circuit boards
    EN 16602-70-11:2015 Space product assurance - Procurement of printed circuit boards
    IEC PAS 61249-8-1:2014 Qualification and performance of electrical insulating compound for printed wiring assemblies
    13/30295424 DC : 0 BS IEC/PAS 61249-8-1 ED.1 - QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
    BS EN 16602-70-11:2015 Space product assurance. Procurement of printed circuit boards
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
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