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RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR,
:
Available format(s):
Superseded date: 23-07-2013
Language(s):
Published date: 23-11-2012
Publisher: Institute of Printed Circuits
Describes qualification and performance of rigid multilayer printed boards with plated-through holes. Circuitry may be bare copper, metallic overplated or coated, fused, unfused, leveled etc.
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